New Chipsets for DLP SLA 3D Printing Released by Texas Instruments

Texas Instruments (NASDAQ:TXN) has released new chipsets for DLP SLA 3D printing that offer superior speed, resolution, and increased affordability.
According to 3D Print.com:
With the chipsets already in their lineup, the DLP Products division of TI is working to make the growing popularity in the 3D printing of circuit boards an even more successful and streamlined exercise, allowing for unique electronics patterns and solder masks. As is usually the case with 3D printing in offering not only great innovation, but also improvement, manufacturers and users are able to enjoy a better process all around with better efficiently and significantly greater affordability.
Now, the Dallas-based company is announcing the release of a new chip even more stunning than the last in what it will be able to do for those involved in using DLP technology for SLA 3D printers.
The DLP9500UV chipset will be claiming its fame as the highest resolution ultraviolet DLP chip available for curing images. With over two million micro-mirrors, large exposure areas can be covered with print sizes near 1µm covered.
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