Nano Dimension Files Patent Application for Combined Process for Simultaneous Curing and Sintering of Two Types of Ink

Nano Dimension (TASE:NNDM,NASDAQ:NNDM) announced that its wholly owned subsidiary, Nano Dimension Technologies, has filed a patent application with the U.S. Patent and Trademark Office for the simultaneous curing and sintering of two types of ink (conductive metal ink and insulator ink) to be used for 3D printing of electronic circuits.
As quoted in the press release:

The technology behind this patent application has the potential to reduce the number of critical systems in a printer and thus allows for a significant reduction in the production costs of the printer, increased printing speed, system miniaturization and increased overall system reliability.
The current standard curing and sintering approach uses a number of different systems to cure and sinter the inks. Each such system adds cost and complexity, while this new approach has the potential to reduce both.
Nano Dimension’s new, innovative method is enabled by the unique chemical structure of the inks, both of which are developed and manufactured in the company’s in-house laboratory. Nanoparticles in the ink absorb radiant energy, causing a plasmonic effect on the surface of the nanoparticle. The plasmonic waves are immediately converted into heat, which causes the fusion of silver nanoparticles due to the high surface energies at the nanoscale. This sintering process results in a final uniform metallic trace.
Nanoparticles in the ink absorb radiant energy, causing a plasmonic effect on the surface of the nanoparticle. The plasmonic waves are immediately converted into heat, which causes the fusion of silver nanoparticles due to the high surface energies at the nanoscale. This sintering process results in a final uniform metallic trace.
The photoinitiated insulating ink absorbs the radiation emitted by the advanced 3D printer’s integrated process system and solidifies instantly. Once cured, the insulating ink demonstrates mechanical strength and high thermal resistance.

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