Intrinsyc Releases Mobile Hardware Development Kit

Intrinsyc Technologies Corporation (TSX:ITC) announced that its mobile hardware development kit (HDK), Snapdragon™ 855 Mobile Hardware Development Kit is now available. Its HDK employs Qualcomm’s (NASDAQ:QCOM) software. Here, Intrinsyc’s new HDK is designed for mobile equipment manufacturers to further develop sophisticated products and applications.

As quoted in the press release:

“The Qualcomm® Snapdragon™ 855 Mobile Platform pushes the boundaries of computing and power performance; with innovations in immersive multimedia, artificial intelligence, and security,” said Victor Gonzalez, Vice President, Engineering, Intrinsyc. “We are very excited to offer access to a comprehensive development kit allowing technology companies and connected device makers to accelerate their product development using the powerful and innovative Snapdragon 855 Mobile Platform.”

The Snapdragon 855 utilizes Qualcomm Technologies’ heterogenous compute expertise to offer a platform for immersive multimedia experiences including eXtended reality (XR), on-device artificial intelligence (AI), lightning-fast connectivity, and a secure processing unit (SPU) engineered to support vault-like security for premium, flagship mobile devices.

Click here to read the full press release.