Intrinsyc Announces Open-Q 605 Single Board Computer and Development Kit

Data Investing

Intrinsyc Technologies (TSX:ITC) announced the avilability of Open-Q 605 Single Board Computer and associated Open-Q 605 Development Kit. The company uses the Qualcomm 400 vision intelligence platform to power next generation connected cameras and other IoT Devices. As quoted in the press release: Intrinsyc’s Open-Q™ 605 SBC is a compact (50mm x 68mm) production-ready SBC …

Intrinsyc Technologies (TSX:ITC) announced the avilability of Open-Q 605 Single Board Computer and associated Open-Q 605 Development Kit.

The company uses the Qualcomm 400 vision intelligence platform to power next generation connected cameras and other IoT Devices.

As quoted in the press release:

Intrinsyc’s Open-Q™ 605 SBC is a compact (50mm x 68mm) production-ready SBC that provides powerful visual computing and edge computing for a variety of targeted applications including; industrial and consumer smart security cameras, action cameras, virtual reality (“VR”), robotics, smart displays, and more. The embedded computing platform is powered by the Qualcomm 400 Vision Intelligence Platform, featuring the Qualcomm® QCS605 System-on-Chip (“SoC”) built specifically to support IoT devices requiring computer vision and AI. The QCS605 supports advanced computing at the edge with a powerful 8-core Qualcomm® Kryo™ 300 CPU, Qualcomm® Adreno™ 615 GPU, Qualcomm® Hexagon™ 685 DSP with Hexagon vector extensions (“HVX”), and Qualcomm Spectra™ 270 ISP. The Qualcomm Vision Intelligence Platform also includes Qualcomm Technologies’ advanced camera processing software, Qualcomm® Neural Processing SDK for advanced on-device AI, image processing, and machine learning, as well as proven Qualcomm Technologies’ 802.11ac Wi-Fi and Bluetooth connectivity and security technologies. Built on 10nm LPP process technology, the QCS605 is engineered for exceptional power and thermal efficiency.
“The Open-Q™ 605 is ready for production use and provides OEMs with a means to rapidly bring their products to market by simply focusing on their industrial design and software applications,” said Cliff Morton, Vice President, Client Solutions, Intrinsyc. “Intrinsyc adds a full range of software development capabilities, including camera integration and tuning, power optimization, audio drivers and tuning, device management, and more, to further accelerate the commercialization of products with breakthrough functionality and performance.”
“Our work with Intrinsyc brings the capabilities of the Qualcomm Vision Intelligence platform into the hands of many developers,” said Joseph Bousaba, Vice President, Product Management, Qualcomm Technologies, Inc. “The Open-Q 605 makes it easier for innovators to create new and exciting IoT products and applications using the advanced technologies in our platform including connectivity, AI, multimedia and camera processing.”

Click here for the full text release.