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Intrinsyc Announces New Design Wins for Embedded Computing Modules to Power Innovative Medical Devices
Intrinsyc Technologies Corporation (TSX:ITC), a leading provider of solutions for the development of embedded and Internet of Things (“IoT”) products announced that two original equipment manufacturers (OEM) have selected Intrinsyc’s Open-Q systems on modules to power their innovative medical devices. The company said that the total value of the services agreements is approximately US$642,000. As …
Intrinsyc Technologies Corporation (TSX:ITC), a leading provider of solutions for the development of embedded and Internet of Things (“IoT”) products announced that two original equipment manufacturers (OEM) have selected Intrinsyc’s Open-Q systems on modules to power their innovative medical devices.
The company said that the total value of the services agreements is approximately US$642,000.
As quoted in the press release:
One of the design wins involves a medical device with integrated camera and will utilize Intrinsyc’s Open-Q™ 626 SOM. The other client will be using a custom version of the Company’s Open-Q™ 820 SOM designed by Intrinsyc specifically to the client’s unique requirements. Total value of the services agreements is approximately US$642,000.
Intrinsyc’s Open-Q™ 626 SOM is an ultra-compact (50mm x25mm) production-ready embedded computing module that is ideal for powering next-generation connected cameras, and other IoT devices. The feature-rich SOM with its advanced processor technology supports premium 4K video with HEVC capture and playback for optimal balance of quality and bandwidth. It offers professional camera features, including; improved dynamic range, enhanced Autofocus performance and computational photography.
“The momentum for Intrinsyc’s Open-Q™ computing modules continues with these two design wins, which follow two other design wins announced earlier this month,” said Mr. Mark Waldenberg, Vice President of Global Sales for Intrinsyc. “Our clients appreciate the premium-performance, high-reliability, and quality design of our production-ready embedded computing modules, as well as our ability to deliver custom computing solutions tailored specifically to their unique requirements.”
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