PEN Announces Development of 3D Printing Suitable Nano-Copper Ink

PEN Inc. (OTCQB:PENC) (“PEN” or “the Company”) reports that it has developed an inkjet nano-copper ink. This ink is intended to be used in the 3D printing of metallic structures.
According to the press release:

“The success of the electronic 3D printing industry depends on the ability to make metallic objects or parts that have a metallic component, but suitable metallic inks and printing methods have not been readily available. The new ink enables novel sintering methods using a photo curing Xenon 2000 unit operated sequentially for each 5 micrometer thick inkjet trace in ambient air and room temperature,” explained Dr. Zvi Yaniv the lead researcher.
The novel 3D copper ink technology was developed at the Company’s Applied Nanotech Inc. subsidiary in Austin, Texas, which serves as the PEN Design Center. Applied Nanotech researchers adapted the Company’s award winning 2D inkjet copper ink, 2009 IDTech Ex Printed Electronics Award and the 2010 R&D 100 award from R&D Magazine, to create 3D metallic copper structures on Kapton substrates.
“3D printing is the fastest growing segment in printed electronics, but without 3D metal printing its scope will be commercially limited. Our new technology has the potential to transform production in a wide range of industries, from medical devices to structural electronics,” said Dr. Richard Fink, President of Applied Nanotech, Inc.

Click here to read the full press release.