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Proposed Change Of Company Name
DC Two Limited (ASX: DC2) (“DC Two” or the “Company”), a vertically integrated revenue generating data centre, cloud, and software business, is pleased to announce the Company’s intention to change its name to Adisyn Ltd and ticker code to AI1, subject to shareholder approval at the upcoming shareholder meeting at 10am on Tuesday, 10 October 2023 (ASX: 8 September 2023).
The Company has worked tirelessly implementing the strategy for the next stage of growth (ASX: 31 October 2022) which is being undertaken by the board and new management team, and during 2023 has successfully:
- Began a full restructure of it’s offerings from being a provider of solely data centre and cloud services, to leveraging its existing assets with a focus on offering generative AI driven solutions powered by microservices. The generative AI market is predicted to increase from ~US$39B in 2022 to ~US$1.3T by 2032, growing at a CAGR of 42%1.
- Reduced fixed costs in the business by over $500,000 per year with an additional $300,000 in savings to be implemented in the FY24 year (ASX: 31 July 2023)
- Completed the acquisition of Attained Group which allows the Company to cover several additional technology layers (ASX: 4 April 2023)
- Completed the acquisition of Thomas Cyber and set up a new Cyber division within the Company (ASX: 17 July 2023)
- Announced the disposal of the Company’s non-core assets, expected to be completed in September 2023, subject to remaining conditions precedent being satisfied (ASX: 31 July 2023)
The proposed new Company name and ticker code is reflective of the growing revenue contribution from cyber security and other solution based services.
AUTHORISATION:
This announcement has been approved for release by the Board of DC Two.
Click here for the full ASX Release
This article includes content from DC Two, licensed for the purpose of publishing on Investing News Australia. This article does not constitute financial product advice. It is your responsibility to perform proper due diligence before acting upon any information provided here. Please refer to our full disclaimer here.
New Generation Atomic Layer Deposition Machine Procured
Specialty semiconductor equipment to accelerate the development of 2D Generation’s next generation chip technology.
Adisyn Ltd (ASX: AI1) (“Adisyn” or the “Company”) is pleased to announce that 2D Generation Ltd (“2DG”) has ordered a highly specialised semiconductor manufacturing system called an Atomic Layer Deposition Machine (“ALD”).
Highlights:
- 2D Generation has ordered highly specialised Atomic Layer Deposition (“ALD”) machine from Beneq
- Beneq is a global leader in ALD equipment with customers spanning the semiconductor and electronics industries
- New generation ALD to complement 2D Generation’s current ALD and accelerate the development of its semiconductor technologies including the graphene coated interconnect
- Installation expected in 5-6 months
- 2D Generation’s semiconductor IP is a critical advancement in semiconductor technology that will enable the next generation of generative AI and semiconductor solutions for data centres and beyond
- Work will continue with 2D Generation’s current equipment
- Adisyn will leverage 2D Generation’s innovative semiconductor solution to generate opportunities in AI1’s target markets including defence applications, data centres and cybersecurity
AI1 entered into a binding Share Purchase Agreement to acquire 2DG, a semiconductor IP business, as announced on 4 November 2024. The companies continue to work together to identify significant opportunities to leverage 2D Generation’s semiconductor solutions and industry relationships to enhance AI1’s offering in its target markets. In furthering that goal, 2DG has ordered a speciality ALD from leading manufacturer Beneq, utilising funds provided by AI1. The companies have entered into a material loan agreement on terms outlined in Annexure A (Loan Agreement Terms).
Atomic Layer Deposition Machine
An ALD machine is utilised in the semiconductor industry to deposit extremely thin layers (down to the atomic layer) of material on to chips. They are found in most semiconductor fabs around the globe.
2DG has ordered an ALD with specific benefits including:
- Liquid source precursor compatible
- Ozone source (O3) compatible
- Reaction chamber for 200 mm wafers, with substrate adapter for 100/150 mm wafers
- Plasma option, deposition temperature up to 400 degrees °C
These features will enable 2DG to achieve a high level of product readiness.
Figure 1. Indicative Beneq ALD System
Beneq is the home of the ALD. In 1984, Beneq established the world’s first industrial production using ALD. Today, Beneq lead the market with products for R&D, semiconductor device fabrication, 3D and batch production, ultra-fast spatial ALD, and roll-to-roll ALD.
Paul Rich, 2DG’s Technology Lead, says“we have spent months specifying the perfect ALD system for our requirements. We canvassed all the major suppliers and decided that Beneq was best positioned to deliver the system that meets our complex technology requirements. I have spent my career working within thin film deposition to advance semiconductor technology and I am confident that with this ALD we will be able to accelerate development towards a commercially viable product that the industry needs. We are continuing development efforts with existing equipment to be ready for the new ALD installation so that we can hit the ground running.”
Paul Rich has more than 35 years of experience in the semiconductor industry. Paul was the Vice President for Technology and Engineering at SPTS Technologies which is owned by KLA Corporation (NASDAQ:KLAC, US$91B market cap), where he managed the product development team until December 2022. SPTS develops and manufactures advanced wafer processing solutions for the world's leading semiconductor and microelectronic device manufacturers. Paul graduated from Bath University in 1987 with a B.Sc in Physics. He has published numerous technical articles and has several patents relating to plasma processing.
Click here for the full ASX Release
This article includes content from Adisyn, licensed for the purpose of publishing on Investing News Australia. This article does not constitute financial product advice. It is your responsibility to perform proper due diligence before acting upon any information provided here. Please refer to our full disclaimer here.
Binding Agreement to Acquire 2D Generation
Adisyn Ltd (ASX: AI1) (“Adisyn” or the “Company”) is pleased to announce, further to its previous announcement on 23 October 2024, that it has now entered into a binding Share Purchase Agreement (“SPA”) to acquire 100% of the issued share capital of 2D Generation Ltd (“2DG or 2D Generation”) (“Acquisition”).
Acquisition to capture enormous opportunities with 2D Generation’s semiconductor technology and the Connecting Chips European Union Joint Undertaking, which includes partners NVIDIA, Valeo, and Applied Materials.
Highlights:
- Adisyn has entered into a binding agreement to acquire 100% of semiconductor IP business, 2D Generation
- Adisyn will leverage 2D Generation’s innovative semiconductor solution to generate opportunities in AI1’s target markets including defence applications, data centres and cybersecurity
- 2D Generation’s semiconductor IP is a critical advancement in semiconductor technology that will enable the next generation of generative AI and semiconductor solutions for data centres and beyond
- The semiconductor market is thriving as the data and computing power required for generative AI continues to grow exponentially – with the acquisition of 2D Generation, Adisyn will be well positioned to benefit from this significant technological opportunity
- 2D Generation is a partner in the EU's Connecting Chips Joint Undertaking with research and innovation partners including NVIDIA, IMEC, Valeo, Applied Minerals, NXP, and Unity
- Completion of the previously announced $3m (before costs) capital raise
AI1 entered into a Collaboration Agreement with 2DG, a semiconductor IP business, as announced on 15 July 2024. The companies have since continued to work together and identified significant opportunities to leverage 2D Generation’s semiconductor solutions and industry relationships to enhance AI1’s offering in its target markets, as well as leverage each other’s business partners to improve market penetration.
Adisyn is delighted to advise that the companies have reached binding terms for AI1 to acquire 100% of the issued share capital of 2D Generation Ltd. The key terms of the Acquisition are included in Annexure A of this announcement (Share Purchase Agreement Terms). Completion of the Acquisition remains subject to satisfaction of various Conditions Precedent outlined in Annexure A.
The Acquisition is a critical move forward for AI1's services businesses for data centres, managed IT, cybersecurity, and generative AI. The Acquisition allows AI1 and 2DG to focus on developing capital- light semiconductor IP solutions for the data centre, cybersecurity, and managed IT business segments rather than competing in the high-capital expenditure (capex) infrastructure space. Based on the Terms of the Acquisition, Adisyn will be able to progress the development and commercialisation of 2D Generation’s unique Intellectual Property (IP).
2DG is a partner in the European Union's Joint Undertaking, ConnectingChips, which has been specifically formed and funded to fast-track the next generation of semiconductor chips to cope with generative AI's ever-expanding processing requirements, need for speed, and lower power consumption. 2D Generation’s solution has the potential to substantially improve the efficiency of data centres and generative AI solutions, as well a range of other real-world technological applications. It is generally accepted that the current generation of AI chips will reach their useful limits by 2030 or sooner.
Capital Raise
As announced on 23 October 2024, the Company has received firm commitments to raise $3 million (before costs) for an equity capital placement, which was subject to the entering into the SPA which has now been satisfied (“Capital Raise”). The placement raised $3,000,000 (before costs) through the issue of 60,000,000 Shares at an issue price of $0.05 each (Placement Shares) together with 1 free attaching Option (exercisable at $0.075 within 3 years of Issue) for every 4 Shares subscribed for and issued, representing 15,000,000 Options (Placement Options).
The Placement Shares will be issued utilising the Company’s existing placement capacity under Listing Rules 7.1 (36,351,000 Shares) and 7.1A (23,649,000 Shares), and will rank pari passu with existing AI1 shares on issue. Allotment of the Placement Shares is expected to occur on or around 6 November 2024. The 15,000,000 Placement Options will be issued subject to shareholder approval.
Background to 2D Generation’s Solution
2DG have developed a patented solution allowing graphene coating at sub-300 degrees centigrade, an achievement that has never been successfully completed prior to 2DG. This opens the door to the next generation of semiconductors capable of further miniaturisation, lower power consumption, less heat and greater computational power.
2D Generation’s innovative technology centres around the aim of improving the performance and capabilities of the interconnect.
- An interconnect in a semiconductor refers to the conductive pathways that connect different components or regions within an integrated circuit (IC).
- These interconnects are crucial for the functionality of the IC as they facilitate the flow of electrical signals between transistors, capacitors, resistors, and other elements on the chip.
- Interconnects can be made of various materials, typically metals like aluminium or copper, and they can be implemented in different layers within the semiconductor structure.
The interconnect field has emerged as a critical technological barrier hindering industry progress. Overcoming this challenge is perceived as the "Holy Grail" within the industry, promising accelerated rates and continued miniaturisation. Industry giants recognise that the entity with a viable solution stands to gain a substantial competitive advantage.
Despite large scale investment from major companies such as ASM International NV (ASMI), Tokyo Electron Limited (TEL), Lam Research Corporation and Veeco Instruments, a significant breakthrough in this domain is still elusive.
Enter 2D Generation. With its groundbreaking innovation enabling in-situ ALD graphene deposition on the interconnect at below 300 degrees Celsius. An achievement that has never been done successfully prior to 2DG. This focus on graphene integration sets 2D Generation apart, presenting a disruptive technology that has the potential to reshape the landscape of semiconductor manufacturing.
2D Generation has demonstrated the deposition of graphene using an Atomic Layer Deposition (ALD) machine. This technological breakthrough holds the potential to revolutionise production devices, enabling faster and more advanced chip manufacturing compared to competitors.
2D Generation is continuing to develop the technology with the aim of commercialising via licences with one or multiple major semiconductor manufacturers. In doing so, the developed technologies will aim to align with AI1’s dual track strategy of AI enablement and advanced data centre and cyber security solutions including:
1. Innovative AI Chips: The partnership will focus on creating intellectual property for electronic photonic power and systems on chips (SoC) and their integration into systems in package (SiP) modules.
2. High-Performance Computing: Applications will target AI, data centres, high-performance computing, and other digital industries, including cybersecurity.
3. Environmental Impact: Addressing the scalability limitations and massive energy demands of semiconductors to reduce societal and environmental costs.
Click here for the full ASX Release
This article includes content from Adisyn, licensed for the purpose of publishing on Investing News Australia. This article does not constitute financial product advice. It is your responsibility to perform proper due diligence before acting upon any information provided here. Please refer to our full disclaimer here.
Adisyn Ltd (ASX: AI1) – Trading Halt
Description
The securities of Adisyn Ltd (‘AI1’) will be placed in trading halt at the request of AI1, pending it releasing an announcement. Unless ASX decides otherwise, the securities will remain in trading halt until the earlier of the commencement of normal trading on Monday, 4 November 2024 or when the announcement is released to the market.
ASX Compliance
Click here for the full ASX Release
This article includes content from Adisyn, licensed for the purpose of publishing on Investing News Australia. This article does not constitute financial product advice. It is your responsibility to perform proper due diligence before acting upon any information provided here. Please refer to our full disclaimer here.
Adisyn Ltd (ASX: AI1) – Reinstatement to Quotation
Description
The suspension of trading in the securities of Adisyn Ltd (‘AI1’) will be lifted immediately following the release by AI1 of an announcement.
ASX Compliance
Click here for the full ASX Release
This article includes content from Adisyn, licensed for the purpose of publishing on Investing News Australia. This article does not constitute financial product advice. It is your responsibility to perform proper due diligence before acting upon any information provided here. Please refer to our full disclaimer here.
Proposed Acquisition of 2D Generation and Capital Raise
The progression of the collaboration to bring forward enormous opportunities with 2D Generation and the Connecting Chips European Union Joint Undertaking, which includes partners NVIDIA, Valeo, and Applied Materials.
Adisyn Ltd (ASX: AI1) (“Adisyn” or the “Company”) is pleased to announce the proposed acquisition of 100% of the issued share capital of 2D Generation Ltd (“2DG”) (“Proposed Acquisition”) and associated capital raise (“Capital Raise”).
Highlights:
- Adisyn has entered into formal negotiations to acquire 100% of semiconductor IP business, 2D Generation
- Adisyn will leverage 2D Generation’s innovative semiconductor solution to generate opportunities in AI1’s target markets including defence applications, data centres and cybersecurity
- 2D Generation’s semiconductor IP is a critical advancement in semiconductor technology that will enable the next generation of generative AI and semiconductor solutions for data centres and beyond
- The semiconductor market is thriving as the data and computing power required for generative AI continues to grow exponentially – with the acquisition of 2D Generation, Adisyn will be well positioned to benefit from this significant technological opportunity
- 2D Generation is a partner in the EU's Connecting Chips Joint Undertaking with research and innovation partners including NVIDIA, IMEC, Valeo, Applied Minerals, NXP, and Unity
- Firm commitments received to raise $3m (before costs), subject to execution of the Proposed Acquisition Agreement
AI1 entered into a Collaboration Agreement with 2DG, a semiconductor IP business, as announced on 15 July 2024. The companies have since continued to work together and identified significant opportunities to leverage 2D Generation’s semiconductor solutions and industry relationships to enhance AI1’s offering in its target markets, as well as leverage each other’s business partners to improve market penetration.
Adisyn is delighted to advise that the companies have reached indicative terms for AI1 to acquire 100% of the issued share capital of 2D Generation Ltd which they will now look to finalise into a legally binding agreement. The Company and 2DG are working towards finalising and executing a binding share purchase agreement (SPA), which is expected to be executed within 3 weeks of todays announcement. The key indicative terms of the Proposed Acquisition are included in Annexure A of this announcement (Indicative Terms). Should the companies execute a binding Share Purchase Agreement, settlement of the Proposed Acquisition will still remain subject to satisfaction of various Conditions Precedent outlined in Annexure A.
The Proposed Acquisition is a critical move forward for AI1's ever-expanding services businesses for data centres, managed IT, cybersecurity, and generative AI. The Proposed Acquisition will allow AI1 and 2DG to focus on developing capital-light semiconductor IP solutions for the data centre, cybersecurity, and managed IT business segments rather than competing in the high-capital expenditure (capex) infrastructure space. Based on the Indicative Terms of the Proposed Acquisition, Adisyn will be able to control the process in the development of 2D Generation’s unique Intellectual Property (IP) and maintain full ownership of the developed IP.
2DG is a partner in the European Union's Joint Undertaking, ConnectingChips, which has been specifically formed and funded to fast-track the next generation of semiconductor chips to cope with generative AI's ever-expanding processing requirements, need for speed, and lower power consumption. 2D Generation’s solution has the potential to substantially improve the efficiency of data centres and generative AI solutions, as well a range of other real-world technological applications. It is generally accepted that the current generation of AI chips will reach their useful limits by 2030 or sooner.
This announcement should be read in conjunction with the Indicative Terms. The Company is optimistic about concluding the SPA and the Proposed Acquisition. However, the Indicative Terms remain subject to negotiation by the parties and the execution of the SPA for the Proposed Acquisition. Completion under the SPA will be subject to a number of conditions, including due diligence, as set out in Annexure A. No binding agreement has been reached at this time and there is no certainty that the Proposed Acquisition will eventuate. The Indicative Terms (and this announcement) is preliminary, incomplete and non-binding and does not constitute a commitment to proceed with the Proposed Acquisition.
Capital Raise
The Company has received firm commitments from new and existing sophisticated investors to raise $3 million via an equity capital placement, which is subject to the entering into of the formal share purchase agreement for the Proposed Acquisition. The Capital Raise will raise $3,000,000 (before costs) through the issue of 60,000,000 Shares at an issue price of $0.05 each (Placement Shares) together with 1 free attaching Option (exercisable at $0.075 within 3 years of Issue) for every 4 Shares subscribed for and issued, representing 15,000,000 Options (Placement Options).
The price for the Placement Shares represents an 9% discount to the Company’s last closing price, and a 6% premium to the Company’s 5 day VWAP. Completion of the Capital Raise is subject to finalising and executing the binding SPA for the Proposed Acquisition. The Placement Shares will be issued utilising the Company’s existing placement capacity under Listing Rules 7.1 and 7.1A. The 15,000,000 Placement Options will be issued subject to shareholder approval.
Click here for the full ASX Release
This article includes content from Adisyn, licensed for the purpose of publishing on Investing News Australia. This article does not constitute financial product advice. It is your responsibility to perform proper due diligence before acting upon any information provided here. Please refer to our full disclaimer here.
IODM: Cloud-based Cash Flow Optimisation Solution for Medium and Large Enterprises
IODM (ASX:IOD) is an Australian company well-positioned to leverage the increasing demand for accounts receivable automation, particularly in medium to large ERP companies. IODM's platform eamlessly integrates with ERP systems like Oracle, SAP, Microsoft Dynamics and Xero, reducing the need for manual invoicing and follow-ups.
The company's flagship product, IODM Connect, is an intelligent accounts receivable platform that enables businesses to automate invoice reminders, payment collections, and cash allocation processes. The platform integrates seamlessly with major enterprise resource planning (ERP) systems such as Oracle, SAP, Microsoft Dynamics and Xero, allowing organizations to adopt the solution without significant disruption to their existing financial workflows.
IODM Connect automates time-consuming tasks involved in accounts receivable management and offers advanced cash allocation and reconciliation features. The platform is also highly scalable and customizable, making it suitable for businesses of all sizes and industries.
Company Highlights
- IODM is a cloud-based accounts receivable communications platform designed to automate and streamline cash collection processes within the terms of trade.
- The platform seamlessly integrates with ERP systems like Oracle, SAP, Microsoft Dynamics and Xero, reducing the need for manual invoicing and follow-ups.
- IODM targets medium to large companies and can handle seamlessly those with multiple divisions with multiple reporting functions
- IODM has been successful in universities and enterprises, with a focus on managing complex billing cycles and cross-border payments.
- The company is already used by ten UK universities, with plans to expand into North America, Asia and Greater Europe.
- IODM operates with a scalable revenue model, combining revenue share and license-based pricing to cater to different customer segments.
This IODM Ltd profile is part of a paid investor education campaign.*
Click here to connect with IODM Ltd (ASX:IOD) to receive an Investor Presentation
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