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Intrinsyc Technologies (TSX:ITC) announced the general availability of a new hardware development kit featuring Qualcomm Snapdragon 670 Mobile Platform. The company said that the new kit, Open-Q 670 HDK enables rapid development of artificial intelligence, camera and multimedia applications for feature-rich mobile devices. As quoted in the press release: The HDK is an open-frame solution …

Intrinsyc Technologies (TSX:ITC) announced the general availability of a new hardware development kit featuring Qualcomm Snapdragon 670 Mobile Platform.

The company said that the new kit, Open-Q 670 HDK enables rapid development of artificial intelligence, camera and multimedia applications for feature-rich mobile devices.

As quoted in the press release:

The HDK is an open-frame solution that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, as well as provide original equipment manufacturers (“OEMs”), developers and engineers with next generation software technology and tools to accelerate development and testing of feature-rich mobile devices. It includes the software tools and accessories required to immediately begin development work. The HDK is a full-featured Android development platform that provides an ideal starting point for creating high-performance mobile devices and applications.

The Snapdragon 670 Mobile Platform is the latest addition to the 600-tier family and is designed to support premium technologies found in higher-tier processors. The Snapdragon 670 features highly integrated architectures, including the Qualcomm® AI Engine, which encompasses the Qualcomm® Hexagon™ DSP, Qualcomm® Kryo™ CPU, and Qualcomm Spectra™ ISP, in addition to related software and framework support. Together, these features and improvements can support leading on-device artificial intelligence (AI), camera, and multimedia applications; for high-quality mobile user experiences.

“The Snapdragon 670 Mobile Platform brings significant enhancement in artificial intelligence (“AI”), camera, and multimedia capabilities to the 600-tier processor family; providing at a great value for mobile device makers,” said Cliff Morton, Vice President, Client Solutions, Intrinsyc Technologies Corporation. “The HDK provides device makers and technology companies access to the Snapdragon 670 Mobile Platform and software tools, and Intrinsyc offers the expertise and support they need to accelerate their product development.”

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